AGEING EFFECT ON TRUE STRESS-STRAIN AND FRACTURE BEHAVIOR OF COLD DEFORMED SOLDER-AFFECTED COPPER
DOI:
https://doi.org/10.59957/jctm.v60.i6.2025.23Keywords:
Hardness, Microstructure, Recrystallization, Scraped copper, Tensile propertiesAbstract
Present manuscript reports the effects of minor Sn-Pb solder on the true stress true strain, impact toughness as well as mode of fracture behavior of commercially pure copper. Heat treatment of cast alloys is done by homogenizing, solution treatment and quenching those. Then the alloys are cold rolled by 75% followed by ageing at room temperature, 150°C and 400°C for one hour each. The results reveal that solder has a positive effect on the tensile properties of the alloy at lower ageing temperature, but does not offer enough benefit at higher ageing temperatures. Both Sn and Pb increase strength through solid solution strengthening, with tin performing better than lead because Sn has a different BCC crystal structure and Pb has a similar FCC structure to Cu. In addition, Pb does not form any intermetallic with Cu but Sn forms various intermetallic with Cu as well as impurities which naturally present in the cast alloys. They also have a significant impact on ductility minima of the matrix. The microstructures exhibit relatively thick grain boundaries of minor alloying elements due to the presence of different particles. Fracture surfaces also indicate such particles that inhibit dislocation movement as well as ensure high strength.
References
L. Collini, Copper Alloys – Early Applications and Current Performance – Enhancing Processes. InTechJanezaTrdine, 2012, Rijeka, Croatia.
J. Cui, E. Forssberg, Mechanical recycling of waste electric and electronic equipment: a review, J. Hazard. Mater., 99, 3, 2003, 243-263.
M. Villena, F. Greve, On resource depletion and productivity: The case of the Chilean copper industry, Resour. Policy., 59, 2018, 533-562.
C. Zeng, B. Zhang, A.H. Ettefagh, H. Wen, H. Yao, W.J. Meng, S. Guo, Mechanical, thermal, and corrosion properties of Cu-10Sn alloy prepared by laser-powder-bed-fusion additive manufacturing, ADDIT MANUF, 35, 2020, 1-8.
A.A. Khan, S. Kaiser, M.S. Kaiser, Electrochemical corrosion performance of copper and uniformly alloyed bronze and brass in 0.1 M NaCl solution, Rev. Mex. Fis., 69, 5, 2023, 1-10.
M. Afifeh, S.J. Hosseinipour, R. Jamaati, Manufacturing of pure copper with extraordinary strength-ductility-conductivity balance by cryorolling and annealing, CIRP-JMST, 37, 2022, 623-632.
S. Constantinescu, A. Popa, J.R. Groza, I. Bock, New high-temperature copper alloys, J. Mater Eng. and Perform., 5, 1996, 695-698.
M.S. Haque, S.A.R. Khan, M.S. Kaiser, Effect of Sc and Zr on Precipitation Behaviour of Wrought Al- Bronze. IOP CONF. SER. MATER. SCI. ENG, 1248, 1, 2022, 1-12.
R.F. Tylecote, The Prehistory of Metallurgy in the British Isles: 5, 1st edition, 1986, Taylor & Francis, London, UK.
M.M. Rahman, S.R. Ahmed, Dry Sliding Friction and Wear of SnPb-Solder Affected Copper against Stainless Steel Counter Surface, ran. mater. sci. eng., 18, 4, 2021, 1-12.
M.M. Rahman, S.R. Ahmed, M.S. Kaiser, Behavior of work hardened SnPb-solder affected copper on corrosion resistance in pH varied environments. EJMSE, 5, 4, 2020, 199-211.
M.M. Rahman, S.R. Ahmed, M.S. Kaiser, On the Investigation of Reuse Potential of SnPb-Solder Affected Copper Subjected to Work-Hardening and Thermal Ageing, Mater. Charact., 172, 2021, 1-19.
M.M. Rahman, S.R. Ahmed, Effects of work-hardening and post thermal-treatment on tensile behaviour of solder-affected copper, Pro. of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications, 237, 5, 2023, 981-1005.
A. Leineweber, The Cu–Sn System: A Comprehensive Review of the Crystal Structures of its Stable and Metastable Phases, J Phs Eqil and Diff., 44, 2023, 343-393.
J. Peng, J. Li, B. Liu, Q. Fang, P.K. Liaw, Origin of thermal deformation induced crystallization and microstructure formation in additive manufactured FCC, BCC, HCP metals and its alloys, Int. J. Plast., 172, 2024, 1-21.
A. Ahmed, N. Iqbal, M.S. Kaiser, S.R. Ahmed, Thermo-mechanical and optical characteristics of cold-rolled copper with natural melting impurities, AIP Conf. Proc., 2324, 1, 2021, 0300171-7.
J.C. Kim, B.H. Ko, I.H. Moon, On some physical properties of nanostructured Cu-Pb alloy prepared by mechanical alloying, Nanostructured Materials, 7, 8, 1996, 887-903.
P. Yang, D. He, W. Shao, Z. Tan, X. Guo, S. Lu, K. Anton, Study of the microstructure and mechanical properties of Cu–Sn alloys formed by selective laser melting with different Sn contents, J. Mater. Res. Technol., 24, 2023, 5476-5485.
S.L. Semiatin, Metalworking: Bulk Forming, Volume 14A, ASM International, 2005, Almere, Netherlands.
Y. Minggao, W. Qingsui, X. Kuangdi, Recovery and Recrystallization. In: Xu, K. (eds) The ECPH Encyclopedia of Mining and Metallurgy. 2023, Springer, Singapore.
D. Raabe, 23 - Recovery and Recrystallization: Phenomena, Physics, Models, Simulation, Physical Metallurgy (Fifth Edition), Elsevier, 2014, 2291-2397.
L. Fan, T. Yang, Y. Zhao, J. Luan, G. Zhou, H. Wang, Z. Jiao, C.T. Liu, Ultrahigh strength and ductility in newly developed materials with coherent nanolamellar architectures, Nat Commun., 11, 6240, 2020, 1-8.
K. Manu, J. Jezierski, M.R.S. Ganesh, K.V. Shankar, S.A. Narayanan, Titanium in Cast Cu-Sn Alloys-A Review. Materials, 14, 16, 2021, 1-36.
S. Kaiser, M.S. Kaiser, Impact of cold plastic deformation and thermal post-treatment on the physical properties of copper based alloys Al-bronze and α-brass. Acta Metall. Slovaca. 12, 2, 2021, 103-108.
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